Technical Profiles

Are Your Customers lining up to use YOUR products or services?

Try our Technical Profiles Supplement and reach 8,000 industry suppliers worldwide!

Technical Profiles is a year-round reference guide of ink suppliers. It will be mailed to Ink World’s 4,500 subscribers and will be distributed at the following major industry events worldwide throughout the year: Technical Profiles 2012
  • NAPIM Convention
  • NPIRI Technical Conference
  • Flexo Forum
  • Middle East Coatings Show
  • Latin American Coatings Show
  • Asia Pacific Coatings Show
  • European Coatings Show 2013
  • Eurocoat 2012
  • CHINACOAT 2012
  • RadTech Meetings
If you are interested in being in Ink World's Technical Profiles 2012, click here to download the brochure!

Options we offer include:
  • Full page, four color ad with facing page profile
  • Full page profile only
  • Profile on Ink World's website
To Order Contact:

Dale Pritchett or Kim Clement Rafferty • 201.825.2552, Fax : 201.825.0553 •
email: inksales@rodmanmedia.com

Europe: Baudry Boisseau Associates • 32.02.513.06.47, Fax : 32.02.514.17.38 •
email: baudry@baudryboisseau.com

China: Mike Hay, Ringier Trade Publishing • 852.2369.8788, Fax : 852.2869.5919 •
email: mchhay@ringier.com.hk

Profile Suggestions:



The Profile page will include a company description, plus information about the markets served, technologies, facilities and major products. Space is provided for a photo or a company logo. The format, as shown on page 3 of this brochure, will be the same for each company. Profiles will run alphabetically. Profile copy should be narrative and informative. Aquestionnaire will be provided to assist you with your company’s Technical Profile. The editor will work with you so that your copy will fit. Artwork must be in color. Prints, slides and transparencies are acceptable; electronic art is welcomed.

If you have any questions about the Technical Profile, please call David Savastano, editor, at (201) 825-2552, ext. 312, or e-mail: dsavastano@rodmanmedia.com.